Internal traverse grinding with electroplated cBN wheels using high-speed process conditions combines high material removal rates and a high surface quality of the workpiece in one single grinding stroke. In order to capture the macroscopic and mesoscopic thermo-mechanical loads onto the workpiece during internal traverse grinding, numerical simulations are conducted at the two scales. This results in a hybrid approach coupling two finite element models with a geometric kinematic simulation. The article focuses on the influence of multiple grain engagements onto a surface layer region using a two-dimensional chip formation simulation.
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